News & Articles

Orico Introduces the CNM2-U4-GY Portable SSD Enclosure: M.2 NVMe to USB4
Orico Introduces the CNM2-U4-GY Portable SSD Enclosure: M.2 NVMe to USB4
Orico has launched the CNM2-U4-GY, a versatile M.2 NVMe SSD enclosure with a 40 Gbps USB4 interface, PCIe 4.0 x4 support, active cooling, and compatibility with multiple drive sizes and interfaces, priced at around $70.
Netac at Computex 2026: Showcasing DDR5 Memory, Portable and Enterprise U.3 SSDs, and Docking Stations
Netac at Computex 2026: Showcasing DDR5 Memory, Portable and Enterprise U.3 SSDs, and Docking Stations
At Computex 2026, Netac unveiled high-speed Shadow II RGB DDR5 memory modules, portable ZX20 V SSDs, powerful enterprise U.3 PCIe 4.0 SSDs, and versatile accessories like the WH43 NVMe enclosure and WF22 docking station, though pricing and availability remain unannounced amid ongoing market uncertainty.
Asustor Unveils Ryzen-Powered Flashstor 6 Gen 3 and Lockerstor NAS at Computex 2026
Asustor Unveils Ryzen-Powered Flashstor 6 Gen 3 and Lockerstor NAS at Computex 2026
At Computex 2026, Asustor showcased a range of new NAS units—including the high-performance Flashstor 6 Gen 3 all-flash model and updated Lockerstor V2 series—alongside the debut of Asustor Claw, an innovative agentic AI platform designed to bring advanced analytics and automation directly to local storage.
Team Group SSDs and Flash Storage Solutions at Computex 2026: Introducing an SSD with Liquid Cooling
Team Group SSDs and Flash Storage Solutions at Computex 2026: Introducing an SSD with Liquid Cooling
At Computex 2026, Team Group unveiled a cutting-edge lineup of SSDs and flash storage—including the liquid-cooled T-Force Liquid II Gen 5 NVMe SSD, blazing-fast Gen 6 and enterprise drives, innovative portable SSDs with E-ink displays and self-destruct features, and eco-friendly USB flash drives—showcasing the brand’s commitment to performance, security, and sustainability.
Exploring Silicon Motion (SMI): New SSD Controllers Deliver Storage Speeds Approaching Those of GPUs
Exploring Silicon Motion (SMI): New SSD Controllers Deliver Storage Speeds Approaching Those of GPUs
At Computex 2026, Silicon Motion Inc (SMI) unveiled its latest SSD controller lineup, including the consumer-focused SM2524XT PCIe Gen 5 controller, the enterprise-grade SM8466 PCIe Gen 6 controller promising near-GPU storage performance for AI workloads, and an updated SM8388 PCIe Gen 5 controller, all boasting cutting-edge speeds, advanced NVMe support, and compatibility with the latest NAND flash technologies.
Lexar’s “AI Storage Stick” Concept Proposes Using M.2 NVMe SSDs as Memory Expansion Cartridges
Lexar’s “AI Storage Stick” Concept Proposes Using M.2 NVMe SSDs as Memory Expansion Cartridges
Lexar is reimagining the M.2 NVMe SSD as a hot-swappable, NES cartridge-style storage solution for mini-PCs, aiming to simplify portable storage and boost AI workloads by integrating a robust front-panel M.2 slot and leveraging a new 3-tiered memory hierarchy to reduce memory footprint by up to 40%.
(PR) Silicon Motion Unveils SM2524XT PCIe Gen 5 DRAMless SSD Controller
(PR) Silicon Motion Unveils SM2524XT PCIe Gen 5 DRAMless SSD Controller
Silicon Motion Technology has unveiled the SM2524XT, a next-generation PCIe Gen 5 DRAMless SSD controller built on TSMC’s 6nm process, delivering up to 14 GB/s sequential read speeds and 2.5 million IOPS to meet the demanding random I/O and low-latency requirements of AI inference and KV Cache-intensive workloads.
Intel’s new USB4Stream driver and protocol enable low-latency device-to-device file sharing in Linux kernel 7.2.
Intel’s new USB4Stream driver and protocol enable low-latency device-to-device file sharing in Linux kernel 7.2.
Intel maintainer Mika Westerberg has introduced a new USB4STREAM driver set to debut in Linux kernel 7.2, enabling direct file and hardware sharing between systems over USB4/Thunderbolt cables—bypassing the network stack and paving the way for fast, app-friendly local transfers without a network connection.
Samsung Combines Two 450-Layer NAND Chips to Create a 900-Layer V-NAND
Samsung Combines Two 450-Layer NAND Chips to Create a 900-Layer V-NAND
Samsung is advancing toward 1000-layer NAND Flash storage by using innovative Cell Multi-Bonding (CMB) technology to stack two 450-layer V-NAND modules into a single 900-layer chip, overcoming manufacturing challenges and setting the stage for next-generation memory breakthroughs.
(PR) Total Revenue of the Top Five Global NAND Flash Suppliers Surged by 83.7% Quarter-over-Quarter in 1Q26 Due to Supply Shortages Driving Up Prices
(PR) Total Revenue of the Top Five Global NAND Flash Suppliers Surged by 83.7% Quarter-over-Quarter in 1Q26 Due to Supply Shortages Driving Up Prices
Soaring AI server demand and a global HDD shortage fueled an 83.7% QoQ revenue surge for the top five NAND Flash suppliers in 1Q26, with Samsung leading the pack and supply shortages expected to persist throughout 2026.