Intel "Razor Lake-AX" SoCs Near Public Release: Key Details Revealed
Intel's upcoming "Razor Lake-AX" system-on-chips (SoCs) are moving closer to launch, with new evidence confirming active development for public release. The latest update from HWiNFO, a widely used hardware monitoring tool, has announced preliminary support for the "Razor Lake-AX" chip. Full preliminary support is anticipated in HWiNFO version 8.51, signaling that these next-generation SoCs are on the horizon.
Positioning Against AMD's "Halo" APUs
"Razor Lake-AX" marks Intel's first direct competitor to AMD's "Halo" series of APUs, which are known for combining powerful integrated GPUs with robust CPU complexes. According to early reports, the "Razor Lake-AX" integrated GPU (iGPU) will be available in two configurations: a standard version with a 16-core iGPU and a flagship model featuring a 32-core iGPU.
Advanced Graphics Architecture and Performance
Both iGPU variants are expected to leverage Intel's Xe3 graphics architecture, the same technology currently utilized in the "Panther Lake" lineup. This advancement could make "Razor Lake-AX" nearly three times more powerful than the current Arc B390 GPU found in Intel's PTL series. The GPU die size is reported to be approximately 162.84 mm², indicating a substantial leap in integrated graphics performance for Intel's consumer platforms.
Return of On-Package Memory
In a notable shift, Intel is reportedly reintroducing on-package memory for the "Razor Lake-AX" SoCs. While the company previously indicated that the Core Ultra 200V "Lunar Lake" would be its last design with on-package memory, sources now suggest that "Razor Lake-AX" will feature on-package LPDDR5X or LPDDR6 memory. This move is expected to enhance memory bandwidth and overall system efficiency.
Innovative Packaging and Manufacturing
The large integrated GPU and advanced features suggest that "Razor Lake-AX" will utilize cutting-edge packaging technologies such as EMIB (Embedded Multi-die Interconnect Bridge) and Foveros 3D stacking to interconnect various chip elements. The SoC is expected to use a BGA-4326 package, featuring 4,326 pins—a design typically reserved for high-end Xeon CPUs. While the exact manufacturing location remains unconfirmed, the scale and complexity of the chip point to Intel's most advanced production capabilities.
Roadmap and Future Plans
Intel had previously considered launching a "Nova Lake-AX" SoC with an even larger 48-core Xe3 GPU paired with a 28-core CPU cluster. However, this project has been postponed, and the "AX" generation will not debut alongside the upcoming "Nova Lake" series. Instead, Intel plans to introduce the first "AX" chips, starting with "Razor Lake-AX," after the "Nova Lake" launch. Current projections indicate that "Razor Lake-AX" will arrive in 2027, setting the stage for a new era of high-performance integrated computing solutions from Intel.
