Kioxia and Sandisk Launch 9th-Generation 2 Tb QLC 3D Flash Memory for AI-Driven Storage
Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation, and Sandisk Corporation have announced the release of their 9th-generation, high-performance 2 terabit (Tb) QLC 3D flash memory technology. This new flash memory is engineered to meet the rapidly increasing storage requirements of AI-powered infrastructure, reflecting the companies’ commitment to advancing storage solutions for data-intensive and cloud applications.
Innovative CBA Architecture Powers Next-Generation Flash Memory
The latest 2 Tb QLC 3D flash memory leverages the CMOS directly Bonded to Array (CBA) architecture, which integrates an advanced CMOS wafer with a proven memory-array platform. This combination, along with significant design and device innovations, delivers notable improvements in both performance and efficiency. The CBA architecture allows for independent advancement of CMOS and memory technologies, enabling faster deployment of advanced storage solutions while maintaining capital efficiency.
Performance Enhancements for AI and Cloud Workloads
Compared to the previous 8th-generation 2 Tb QLC flash memory, the new 9th-generation technology offers substantial upgrades. The adoption of a 6-plane architecture results in higher write and read bandwidth, as well as improved power efficiency for both operations. The NAND interface speed has been increased to 4.8 Gb/s, representing a 33% improvement over the previous generation. These enhancements are particularly valuable for AI-driven workloads, which demand high throughput and energy-efficient storage solutions.
Supporting the Evolving Demands of AI Infrastructure
As artificial intelligence continues to drive innovation across industries, storage technologies must evolve to keep pace with increasingly complex and diverse data usage. The 9th-generation QLC 3D flash memory is designed to support a wide range of AI applications, from generative AI to agent-based and physical AI systems. By combining proven memory cell technology with the latest CMOS advancements, Kioxia and Sandisk are able to deliver high performance while optimizing investment costs.
Strengthening Collaboration and Advancing NAND Innovation
The introduction of this advanced QLC 3D flash memory marks a significant milestone in the ongoing collaboration between Kioxia and Sandisk. By maximizing the flexibility of the CBA platform, both companies are driving new opportunities for NAND innovation and helping customers address the growing storage needs of the AI era. This development underscores their leadership in the flash memory industry and their commitment to supporting the next generation of data-driven technologies.
