Samsung Unveils Next-Generation HBM4E Memory with 16 Gbps Speeds
At the Hot Chips 2026 conference, Samsung’s Sangwook Han announced a major advancement in high-bandwidth memory technology: the upcoming shipment of HBM4E memory operating at 16 Gbps per pin. This development marks a significant leap for Samsung’s Semiconductor division, which began shipping HBM4E at 14 Gbps per pin in late May. The confirmation of 16 Gbps speeds highlights Samsung’s rapid progress in memory scaling and reinforces its leadership in the high-performance memory market.
Breakthrough Bandwidth for AI and GPU Applications
Samsung’s HBM4E memory currently achieves a maximum bandwidth of 3.6 TB/s per stack, thanks to its 14 Gbps per pin speed and 2,048 pins per stack. With the transition to 16 Gbps per pin, this bandwidth will increase to an impressive 4 TB/s for a single HBM4E stack. In high-performance computing environments, such as AI accelerators and GPUs that utilize multiple memory stacks, the aggregate memory bandwidth will reach unprecedented levels, enabling faster data processing and improved system performance.
Flexible Configurations and Advanced Manufacturing
Samsung is initially offering HBM4E in a 12-layer (12-high) configuration, delivering a memory density of 48 GB per stack. The company also plans to support additional configurations, including 8-layer 32 GB and 16-layer 64 GB stacks, to meet diverse customer requirements. This flexibility allows system designers to optimize memory capacity and bandwidth for a wide range of applications, from AI training to high-end graphics processing.
The HBM4E memory is manufactured using Samsung’s 6th-generation 10 nm class process, specifically optimized for DRAM. Multiple layers are stacked to achieve high density and performance. Additionally, the technology incorporates a custom base die produced on Samsung’s advanced 4 nm SF4 node, ensuring seamless integration and compatibility with various packaging solutions. This combination of cutting-edge process technology and innovative design positions Samsung’s HBM4E as a key enabler for next-generation computing platforms.
