The Chinese Loongson 3D5000 boasts 32 cores and is four times swifter than the typical Arm chip.

Chinese companies are meeting the growing demand for domestic data processing silicon by releasing more products, as the push for technology independence continues. Loongson, a Chinese company, has launched a 3D5000 CPU with 32 cores, using chiplet technology. The 3D5000 is a combination of two 16-core 3C5000 processors based on LA464 cores, following the LoongArch ISA that combines RISC and MIPS ISA design principles. The new chip has 64 MB of L3 cache, supports eight-channel DDR4-3200 ECC memory achieving 50 GB/s, and has five HyperTransport (HT) 3.0 interfaces. The chip has a TDP configuration of 300 Watts, but normal operation is around 150 Watts, with LA464 cores running at 2 GHz.

The 3D5000 supports 2P and 4P configurations, allowing a single motherboard to become a system of up to 128 cores. Loongson uses a 7A2000 bridge chip to connect them, which is reportedly 400% faster than the previous solution. The chip size is 75.4x58.5×6.5 mm and is based on the LGA-4129 package. Loongson claims that its designs are up to four times faster than the average Arm chip that goes into smartphones. In SPEC2006, performance reaches 425 points, while maintaining a single TeraFLOP at dual-precision 64-bit format.

The processor was built for security, with custom hardware-baked security to prevent Spectre and Meltdown, an on-package Trusted Platform Module (TPM), and a secret China-made security algorithm with an embedded custom security module that does encryption and decryption at 5 Gbps.