In the age of technological advancement and the growing need for data processing power, data centers are consuming more energy and producing excess heat. SUNON, a global leader in thermal solutions, is at the forefront of this issue by offering a range of state-of-the-art liquid cooling solutions specifically designed for advanced data centers equipped with high-capacity CPU and GPU computing for AI, edge, and cloud servers.
SUNON's liquid cooling design services are ideal for modern data centers, generative AI computing, and high-performance computing (HPC) applications. These solutions are carefully tailored to fit the cooling space and server density of each data center. With their compact yet comprehensive design, they ensure exceptional cooling efficiency and reliability, ultimately leading to a significant reduction in a client's total cost of ownership (TCO) in the long run. SUNON's liquid cooling solutions also play a crucial role in promoting corporate sustainability as companies strive to achieve net-zero emissions standards. They provide a win-win situation for clients looking to transition to greener and more digitalized operations. SUNON offers a wide range of cooling modules and systems, including direct cooling solutions, rear-door heat exchangers (RDHx), and reservoir and pumping units (RPU).
For example, SUNON's open-loop direct cooling modules have been seamlessly integrated into various rack server applications. These solutions are designed to align with system structures, ensuring a unique thermal contact configuration between surfaces, curvature of water pipes, and coolants. They cater to servers with high-performance cooling requirements, such as thermal contact resistance (Rth) below 0.04 ℃ /W, liquid flow of 1.25 LPM, and TDP of up to 700 W. Importantly, these cooling solutions are fully compatible with Intel dual Socket Eagle Stream (EGS) Processors, thereby enhancing operational efficiency.
