News & Articles

At Computex 2026, Dato unveiled its latest memory and storage innovations, including the retro-styled Ares Armor Lite DDR5 RAM, the high-speed Ares Aethon Gen 5 NVMe SSD, and the enthusiast-grade Ares Aerofin SSD featuring active cooling and blazing-fast transfer rates.

GIGABYTE set new overclocking world records at Computex 2026, including a DDR5-13556 MT/s milestone and 10 global firsts, thanks to their elite team and cutting-edge Z890 AORUS TACHYON DUO X ICE and X870 AORUS INFINITY motherboards.

Cooler Master and G.SKILL have teamed up to unveil the MasterDimm AC DDR5 memory with advanced active cooling—promising ultra-high capacities, extreme overclocking speeds, and whisper-quiet operation—which will debut at Computex 2026 as part of Cooler Master’s vision for next-generation, thermally-optimized AI and gaming systems.

G.SKILL is unveiling a groundbreaking DDR5-9200 32GB (2×16GB) CU-DIMM memory kit running at just 1.1V on the MSI MEG Z890 GODLIKE motherboard, demonstrating ultra-high speeds with exceptional voltage efficiency—on display at Computex 2026.

G.SKILL will unveil its latest DDR5 memory innovations for gaming, AI, servers, and workstations at Computex 2026, alongside hosting the highly anticipated OC World Record Stage, OC World Cup, and Extreme Mod Stage, featuring live overclocking competitions and creative system mods.

Chinese DRAM maker CXMT is now mass-producing DDR5 chips that have begun appearing in popular retail memory modules like Corsair Vengeance, signaling increased competition in the global memory market and raising concerns among financial advisors about potential downward pressure on DRAM prices as Chinese brands expand their reach.

ASUS has debuted its first ROG-branded DDR5 memory kits—featuring a striking design, 48GB capacity, and exclusive "ROG Mode" profile—targeted at enthusiasts and launched alongside a new ROG-certified memory program.

V-Color Technology has announced its OC RDIMM memory lineup now fully supports Intel Xeon 6 processors and Intel W890 chipset workstations, offering modules up to 256 GB and speeds up to 9600 MT/s—ideal for professionals needing high bandwidth, scalable capacity, and reliable performance for demanding workloads like AI, rendering, and simulation.

Micron Technology has begun sampling its new 256 GB DDR5 RDIMM—built on advanced 1-gamma technology and 3D stacking—to key server partners, promising over 40% faster speeds and significant power savings to meet the growing memory demands of next-generation AI and data center workloads.

SK hynix is partnering with Intel to explore integrating Intel’s advanced EMIB 2.5D packaging technology into its HBM memory modules, aiming to diversify its supply chain and support next-generation AI accelerators as alternatives to TSMC’s CoWoS reach their limits.